| BL-series | BM-series | AM-series | MA-series | LV-series | |
|---|---|---|---|---|---|
| Development | Solvent | Solvent | Aqueous | Aqueous | Solvent |
| Patterning | Negative | Negative | Positive | Positive | Negative |
| Structure | Polyimide | Polyimide | PBO | Phenolic Resin | Polyimide |
| Application examples | WLCSP,Fan-Out | RDL+WB,Flip Chip | Buffer Coating | Buffer Coating | Panel |
| Features | Wide cure margin (200~390 degC) High elongation Compatibility with Cu |
Wide cure margin (200~390 degC) High Tg＆Young’s modulus Compatibility with Cu |
High sensitivity | Low curing temperature (200~390 degC) Low stress |
Compatibility with slit coating Wide cure margin (200~390 degC) High elongation Compatibility with Cu |
Asahi kasei pimel BL301由日本旭化成株式会社生产的一款负性PI光阻材料，用于半导体先进封装。
